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MediaTek Reveals Dimensity 9000 Chip With Cortex-X2 Core

MediaTek Dimensity 9000
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MediaTek has officially unveiled its latest high-end chipset known as the Dimensity 9000. Although the company has rolled out flagship chipsets before, they weren’t as widely accepted as Qualcomm’s flagship SoCs. MediaTek is trying to change this with the new Dimensity 9000.

The chipmaker claims that the Dimensity 9000 is the world’s first 4nm-class mobile chipset. It includes support for the Arm Cortex-X2 CPU core, dubbed as Arm’s most powerful offering yet. The chipset is also the first to introduce this new Arm CPU core. As you would expect, the Dimensity 9000 is an octa-core chipset with a familiar configuration of CPU cores (via).

The GPU on the Dimensity 9000 offers a 20% performance improvement over the predecessor

The chip consists of one Cortex-X2 CPU core with a clock speed of 3GHz, three Cortex-A710 cores at 2.85GHz, and four Cortex-A510 cores at 1.8GHz. Both the CPU and GPU designs are built on the latest ArmV9 architecture.

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Further, it brings Arm’s Mali-G710 GPU, which can power a FullHD+ display at up to 180Hz. MediaTek claims that the GPU brings a 20% performance upgrade over the predecessor. The manufacturer also said it would launch a new raytracing SDK for game developers, allowing them to build titles compatible with the new GPU.

Moving on to the camera, MediaTek is packing an 18-bit HDR ISP (Image Signal Processor). This can reportedly record 4K HDR videos simultaneously on up to three cameras. The inclusion of “Super Night Video Recording” is exciting as it could finally solve the issue of recording videos in dim environments. The chipset also supports camera sensors of up to 320-megapixels.

Additionally, MediaTek is bringing its 5th generation AI processing unit or APU with the Dimensity 9000. This reportedly brings 4x power efficiency compared to the predecessor. There’s a 5G modem built into the new chipset with 3CC Carriers Aggregation (300MHz) and 7Gbps downlink support. Other features include Bluetooth 5.3 and Wi-Fi 6E 2×2, so it’s future-proof as well.

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The chip manufacturer said the first devices with the Dimensity 9000 will launch by Q1 2022, so we have a few more months to go. The announcement comes as the world waits for Qualcomm’s newest flagship SoC, known as the Snapdragon 898/8 Gen1, which will break cover later this month.