X

Galaxy S22 Ultra "Chin" May Be Thicker Than You Think

Samsung Galaxy S21 Ultra AH 01
Advertisement
Advertisement

The Samsung Galaxy S22 Ultra “chin” may be thicker than you think. According to information provided by Ice Universe, a well-known tipster, the Galaxy S22 Ultra bottom bezel will be thicker than the one on the Galaxy S22+.

The Galaxy S22 Ultra “chin” is said to be thicker than the Galaxy S22+’s

Do note that this doesn’t mean it will be thick, though, not at all. He simply stated that the Galaxy S22+’s will be thinner. The difference could be completely negligible, though, so keep that in mind.

As most of you know by now, the Galaxy S22 Ultra will offer a considerably different design compared to the Galaxy S22 and S22+. It will have a different camera setup and design, and on top of that, it will ship with an S Pen stylus and a dock for it.

Advertisement

That dock may be the reason its bottom bezel ends up being slightly thicker than the one on the Galaxy S22+, but we’re only guessing here. We also don’t know what will the case be with the Galaxy S22. We’re assuming that its bottom bezel will be the same thickness as the one on the S22+, but we’ll see.

All three of these smartphones are expected to launch in February

All three of these smartphones are expected to arrive in February. According to a recent report, all three phones will launch on February 8. That puts their launch about a month after the Galaxy S21 FE’s announcement.

The Galaxy S22 and S22+ will resemble their predecessors quite a bit. Samsung won’t change much in regards to the design, though that was to be expected. They will come with improved hardware, though.

Advertisement

Samsung is looking to utilize both the Snapdragon 898 and Exynos 2200 inside these phones. Neither of those two chips have been announced thus far, but announcements are expected soon.

The Exynos 2200 is expected to become the company’s first SoC with an AMD GPU, by the way. In any case, the Galaxy S22 series will be quite interesting, that’s for sure.