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MediaTek Dimensity 7000 5nm SoC To Bring 75W Charging, ARM V9 CPU

MediaTek Dimensity 5G SoC specs architecture
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MediaTek last week unveiled its latest flagship smartphone SoC. Called Dimensity 9000, the new chipset will power flagship devices coming out next year. Now, we have some information about the company’s next-gen upper mid-range offering. Noted Chinese leakster Digital Chat Station has revealed that MediaTek will call its upcoming premium smartphone chipset the Dimensity 7000 (via). The source shared the information on the Chinese microblogging platform Weibo.

According to the report, the Dimensity 7000 will be based on TSMC’s 5nm manufacturing process. The current generation of flagship SoCs such as the Snapdragon 888 and Exynos 2100 are all 5nm chipsets. MediaTek’s new offering, the Dimensity 9000, is a 4nm processor. Its predecessor, the Dimensity 1200 is a 6nm SoC. So the Taiwanese chipmaker is now looking to hit the sweet spot by launching a 5nm premium smartphone processor that will power lower-cost flagship devices in 2022.

What’s even more impressive is that the Dimensity 7000 is said to employ ARM’s latest v9 CPU core architecture, the same architecture that MediaTek used on Dimensity 9000. So that should mean significantly improved CPU performance over the current upper mid-range chipsets. We will have to wait for more details on CPU arrangements and clock speeds to confirm how big an upgrade the Dimensity 7000 will be.

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Other reported information about the upcoming Mediatek chipset is regarding its charging power. According to the new report, the Dimensity 7000 will support up to 75W fast wired charging. That puts it between the outgoing Snapdragon 888 and Snapdragon 875, which is quite impressive for a non-flagship chipset.

MediaTek is looking to extend the gap on Qualcomm with its 2022 Dimensity lineup

MediaTek last year overtook Qualcomm as the world’s largest smartphone chipset vendor. The company’s new Dimensity lineup of 5G smartphone processors has been doing well, but the surge is mainly thanks to strong performance in the entry-level and budget segments. It has held onto that lead this year as well. However, the Taiwanese chip giant hasn’t quite managed to catch on to Qualcomm in the flagship segment.

With the launch of the Dimensity 9000, as well as the upcoming Dimenstiy 7000, MediaTek is now looking to challenge the American chipmaker in the flagship segment as well. Time will tell whether it manages to do that next year. Early signs are quite promising though.

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MediaTek has reportedly started testing the Dimensity 7000. So that should mean the official announcement isn’t too far off. We expect to hear more about this chipset in the coming weeks.