According to the source, the Snapdragon 875 will be the company’s first processor made using a 5nm manufacturing process. That process will result in better performance, and lower power consumption.
This leak has been “tipped by a reader”, and it includes the Snapdragon 875 specifications
Do note that these specifications have been “tipped by a reader”, says the source. We’re not sure how accurate is this information, so take it with a grain of salt, as it’s just a leak.
The Snapdragon 875 specifications leak info reveals that the phone will include the Kyro 685 CPU built on the Arm v8 Cortex tech. It will also include a new Snapdragon X60 5G modem-RF system.
This whole chipset is codenamed SM8350, which is a follow-up to the SM8250 (Snapdragon 865). The Adreno 660 GPU will be included, and backed by the Adreno 665 VPU, and Adreno 1,095 DPU.
The chip will include a 3G/4G/5G modem (mmWave and sub-6 GHz bands). The Qualcomm Secure Processing Unit (SPU250) will also be included, and the same goes for the Spectra 580 image-processing engine.
The Snapdragon Sensors Core Technology is tipped to be included as well, along with the External 802.11ax, 2×2 MIMO, and Bluetooth Milan.
The Compute Hexagon DSP with Hexagon Vector eXtensions and Hexagon Tensor Accelerator are tipped to be included as well. The same can be said for a quad-channel package-on-package (PoP) high-speed LPDDR5 SDRAM.
Audio improvements will be on board as well
In terms of audio, the Snapdragon 875 will bring improvements as well. It will offer a low-power audio subsystem combined with Aqstic Audio Technologies WCD9380, and WCD9385 audio codec.
As you can see, quite a few details got shared here. This detail is quite specific, and it’s even possible it’s accurate. We just have no way of confirming it, and it comes from an unverified source.
Qualcomm will probably announce the Snapdragon 875 in December this year, one year after the Snapdragon 865. Do note that the current health crisis could impact the production and everything, so it may arrive later than expected.
The whole situation may push the announcement to 2021, but that hopefully won’t happen. The chip will reportedly be manufactured by TSMC.