Plenty of Xiaomi Mi 9 info surfaced online today, including the phone’s announcement date, as well as real-life images of the device, and even some of its specifications. All of which now provide a clearer picture of what prospective buyers can expect from the latest major smartphone from Xiaomi.
Starting with the announcement date, the company confirmed via its official Weibo (Chinese social media) page that the phone will be announced on February 20, which is the same day that Samsung will announce the Galaxy S10 series. Xiaomi's event is currently due to take place in China.
The company also revealed that the codename of the device is “Battle Angel”, and that it will ship with three rear-facing cameras, aligned vertically along with the LED flash.
Beyond the official confirmation, a bunch of real-life images of the Xiaomi Mi 9 have now also surfaced and revealing much of the design of the phone. For example, the images reveal that the phone will be made out of metal and glass, and the company’s logo sits on the back of the device.
Based on the images, the device will include extremely thin bezels, and that pretty much applies to all the bezels, even though the bottom bezel will be slightly thicker than the rest. In addition, a waterdrop display notch is also on offer and appears to be fairly small. The phone’s front-facing camera will sit inside of that notch, while an earpiece is located right above it. The phone’s display will sport rounded corners, and there's a number of physical keys on the sides.
On the right-hand side of the device will sit the phone’s volume up and volume down buttons, with a power / lock key placed right below them. On the left is an extra physical button which could be used to activate the Google Assistant, though chances are that the company will allow you to remap that button to whatever you like.
In addition to the leaked images, some specifications for the Mi 9 have also now come to light. Some of these have come from the Xiaomi Mi 9’s software (shown in one of the images below), while additional info surfaced in China and is therefore should not be taken as confirmed information for now. According to the rumored details, the Xiaomi Mi 9 will include a 6.4-inch AMOLED display covered by Corning’s Gorilla Glass 5 protection.
As far as the cameras are concerned, it is said that the device will include 48-megapixel and 12-megapixel sensors on the back, in addition to a TOF (Time-of-Flight) camera. The device will be fueled by the Snapdragon 855 64-bit octa-core processor by Qualcomm, and at least one of the Mi 9 variants will ship with 6GB of RAM (most likely the base model). A 3,500 mAh capacity battery was also mentioned, and so was 27-watt fast charging.
The Xiaomi Mi 9 is expected to come loaded with 128GB of RAM, and running on MIUI 10. You can check out the images in the gallery below for a better look at the company’s upcoming flagship.