Upcoming AGM X3 Rugged Handset Leaks With Benchmark Results

During this year’s Mobile World Congress (MWC) in Barcelona, AGM confirmed that its X3 handset will become available in the summer, and a real-life leaked image of the phone just surfaced, along with its benchmarking results. Back in February, AGM mentioned that the X3 will be fueled by the Snapdragon 845 64-bit octa-core processor from Qualcomm, and these benchmarking results sure confirm that. For those of you who do not know, the Snapdragon 845 is Qualcomm’s most powerful offering at the moment, and one of the most powerful mobile SoCs out there.

If you take a look at the provided image of the device, you will notice that the phone will be made out of metal, and that it will ship with a vertically-aligned dual camera setup on the back, below which you’ll notice a fingerprint scanner. AGM’s logo is also included on the back, and the back side of the phone is curved. Now, the AGM X3 will be a rugged smartphone, which is why the corners of this phone are reinforced for drops, as you can see in the provided images. The phone’s power / lock key will be included on the right, while its volume up and volume down buttons will sit on the left. The AGM X3 will also be IP68-certified for water and dust resistance, as expected.

The AGM X3 will also be shock-proof, on top of its IP68 certification, while the device managed to score 2,807 points in the single-core test on Geekbench, and was able to hit 9,154 points in the multi-core test on Geekbench. As far as AnTuTu is concerned, the AGM X3 was able to hit 286,230 points. That is more or less all the info that surfaced, though the device is expected to arrive in the near future, AGM reiterated that the device is coming this summer, so all we can do at this point is wait.

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