The hands-on images leaked yesterday depicting the alleged Huawei P20 were apparently pulled from a video showcasing the device from all angles, as seen below. The video was originally published on Chinese social network Weibo where the original poster seems to suggest that this is a pre-production unit which was presumably captured on camera in one of Huawei’s facilities. Much like before, the video reveals an inconspicuous-looking smartphone shaped like a thick slab of glossy glass with rounded edges and corners, and the only design element that sticks out lies in the protruding dual-camera setup.
There are some inconsistencies surrounding the Huawei P20 leaks in that the device seen in the video below looks very different from the alleged Huawei P20 which was seemingly approved by China’s regulatory agency TENAA earlier this month. In the photographs attached to the TENAA application, the alleged P20 carries a physical button on the lower bezel which should double as a fingerprint scanner, while the device shown in the video below lacks this particular characteristic altogether. This might suggest that, regardless of how the smartphone will be called, the pre-production unit captured on film could employ an in-display fingerprint sensor, or ditch the technology altogether in favor of a different security solution. Additionally, while it was previously suggested that the Huawei P20 will feature a vertically aligned dual-camera system, the device showcased in the leaked video carries a horizontal dual camera combo protruding from the glossy surface of the back panel. Other details seen in the latest leak include the familiar Huawei branding on the lower area of the back, as well as the Leica branding in the upper right corner, suggesting that the Chinese OEM will continue to use Leica optics in its Android flagships.
At this point in time, it’s unclear what the Huawei P20 will look like, but either way, the device is expected to launch as the company’s new flagship and as such, it should carry high-end internal components such as the Kirin 970 octa-core SoC developed by the firm’s semiconductor subsidiary HiSilicon. This is the OEM’s most powerful mobile chipset solution to date and was previously employed by the Mate 10 series launched late last year.