Sony announced their new flagship lineup of smartphones, the Xperia Z5, Xperia Z5 Compact and the Xperia Z5 Premium, which feature a redesigned camera module with 23 megapixels and the fastest autofocus available. For the first time, Sony included a fingerprint scanner in the now reshaped power button in all three models. For better or for worse, the design is still similar to what we have come to expect from the company, but the back cover still made from glass now provides a matte look on the Z5 and the Z5 Compact, the Premium version, on the other hand, has a shiny and mirror-like surface on the back, making it stand from the rest.
In terms of specs, the Xperia Z5 Premium really outperforms every other smartphone in the display department, as it is the first one to include a 4K resolution in a 5.5-inch screen, resulting in a super high density of 806 ppi. The rest of the specs, while not bad at all, are not as impressive. It includes the Snapdragon 810 processor, which is still Qualcomm’s best offering, but its performance has been questioned all year long and let’s not forget about the problems it reportedly has with the way it handles the temperature when using some intensive apps. One might wonder how this processor will perform with the extremely dense display, but apparently Sony figured out a way to keep it cool.
In a picture of a disassembled Z5 Premium where the internals are visible, it can be seen that a dual cooling heat-pipe system is in place on the upper part of the device, probably close to where the processor is located. Additionally, it was reported that the phone contains a layer of thermal paste to hold the pieces together, so this might further help to make the surface a less warm to the touch. It would be interesting to see if this system really works and if the company integrated it in the other two phones. With all the controversy surrounding this processor, more information regarding this aspect, as well as test results, will surely appear when the phone is released on November.