Meizu PRO 6 confirmed design_1

Meizu’s CEO: This Is The Upcoming Meizu PRO 6

April 7, 2016 - Written By Kristijan Lucic

Meizu has introduced a new smartphone yesterday, the Meizu M3 Note. The company has been teasing this handset for quite some time now, and the mid-ranger not only sports a really solid set of specs, but it’s also made out of metal, which is a first for Meizu’s ‘M Note’ line. That being said, the M3 Note is not the only smartphone Meizu has been teasing lately, the company has been sharing PRO 6 teasers for quite some time now, read on.

The company has already confirmed that the PRO 6 flagship will sport a fullHD (1920 x 1080) display, metal body, pressure sensitive display, and that it will be fueled by the Helio X25 processor by MediaTek. Meizu will have exclusive rights to this chip for a period of time, as it was announced by Meizu’s execs during MediaTek’s event. That being said, the company’s VP has showcased PRO 6’s innovative antenna design a while back, and now we have a new confirmation to share with you coming directly from the company’s CEO. If you take a look at the provided image, you’ll get to see the upcoming Meizu PRO 6 from the back, this image was shared by Huang Zhang, also known as Jack Wong. Meizu’s CEO has basically confirmed the design of the Meizu PRO 6 with this image, well, at least the design of its back. This image, however, fits with a recent leak we’ve seen, so it’s possible we know the design of the front side of this phone as well. The rear-facing camera is clearly visible here, and below it, you’ll notice the round flash sensor which surrounds the laser autofocus which is located in the middle. The power / lock and volume rocker physical keys are placed on the right side of this phone, which probably means the SIM tray will be located on its left side.

The Meizu PRO 6 is expected to sport a fullHD AMOLED display, though we still don’t know its size. It’s possible that Meizu will opt for the same size used by the PRO 5, 5.7-inches, but we’ll see. The device will be fueled by the Helio X25 64-bit deca-core SoC, as already mentioned, and it will sport a physical home button up front, also known as the mBack button. The fingerprint scanner will be built into the home button, and the device will ship with Android 5.1 Lollipop or 6.0 Marshmallow with Meizu’s Flyme UI on top of it. This device is going to be announced on April 12th, when the company plans to host another event in China.