The Samsung Galaxy S7 appears to be getting in the spotlight more often than not, which is unsurprising given the fact that the new series is jam-packed with interesting technologies, ranging from a unique and powerful 12-megapixel camera to a passive cooling system keeping the SoC’s temperature in check. Most of these components have already been both reviewed and disassembled, but more recently a Reddit user who happens to own a Samsung Galaxy S7 gave fans of the device a different view on its internal components, by using an industrial X-ray machine to scan the phone and reveal its hardware without risking any damage. Furthermore, the X-ray images offer a sneak preview on certain components located too deep within the package to be easily visible to the naked eye.
Broadly speaking, there are two types of smartphone users; those who use their devices without caring too much about what makes them tick, and those who adopt the opposite approach. For the latter category, the gallery of X-ray images shared by Reddit user “SecretRaindrop” is certainly a treat. The high-resolution X-ray scans offer a different view on the Samsung Galaxy S7’s hardware components and reveal a handful of interesting characteristics such as the wiring assembly within the SoC’s cooling pipe, whose purpose is to help dissipating heat generated by the chipset. You can also get a close-up view of the powerful 12-megapixel camera and the optical image stabilization mechanism, the loudspeaker, the 3.5 mm headphone jack, and the motherboard itself. Another Reddit user even stitched the X-ray photo gallery together into a single image, offering a more cohesive view of all the smartphone’s internal components, including the wireless charging coil. The same user even created a false color gradient map of the X-ray scan with the purpose of highlighting the more or least dense areas within the smartphone’s case.
It might be worth noting that the Samsung Galaxy S7 unit used for creating the X-ray gallery is the variant powered by Samsung’s own Exynos 8890 SoC, and not by Qualcomm’s Snapdragon 820 chipset. However, aside from the SoC, most other components are identical on both versions of the phone.