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Sony Xperia Z3+ Suffers Heat Issues From Snapdragon 810 V2.1

June 8, 2015 - Written By Dennis Patrick

Qualcomm can’t seem to get away from the on-going accusations that their latest Snapdragon 810 chipset is providing more problems than improvements. This all began a few months ago when rumors of the Snapdragon 810 chipset started having trouble with overheating smartphones that came equipped with it. News publications all over, took the story and started to turn out headlines that later caused Qualcomm to put out these fires. Most recently, Qualcomm spoke with Forbes to state that these alleged overheating rumors were simply false, although it did look like the damage was already done. Now that the waters have started to cool, Qualcomm may be in trouble once again with new rumors and evidence showing the Snapdragon 810 chipset may still be a root source for overheating issues with a line of Sony devices.

Reports around the web have revealed that Qualcomm has developed a new 2.1 alteration of the Snapdragon 810 chipset. With the new 2.1 Snapdragon 810 chipset, Qualcomm focused on making adjustments to thermal management, but that might have backfired. Sony happens to be one of the first OEM’s to try the new chipset out in their line of devices such as the Xperia Z3+ and the Xperia Z4 tablet. Btekt released a video to show off the new chipset in action with the Xperia Z3+, although the results are unsatisfying. The main indicator that the Snapdragon 810 chipset may still be facing overheating issues becomes apparent when using the stock camera application.

Btekt begins to use the camera application when a warning indicator pops up stating that the application will need to close down so the Xperia Z3+ can cool off. Upon waiting for the device to cool down, a new notification appears stating that the device has return to a more normal temperature range in which the user can now reopen and use the application. This issue came up before with the LG G Flex 2. A benchmark showed the LG G Flex 2 was suffering from overheating issues, although it is worth noting that this was a pre-release model of the handset. Tim McDonough, Qualcomm’s VP of marketing, spoke to Forbes on that particular matter in the past stating that this was an early build of the smartphone that was made to locate and fix any bugs or issues before a retail version is developed and released to the public. Sony’s Xperia Z3+ used by Btekt, was being used with a pre-release firmware so there is a chance that this overheating problem may get resolved before the official release.