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The Alleged Sony Xperia Z4 Chassis Leaks, Waterproofing Might Be A Thing Of The Past

March 6, 2015 - Written By Kristijan Lucic

Sony has quite recently said that they’re not going to move to a 12-month release cycle, which essentially means the company intends to keep releasing 2 flagship devices a year. Sony Xperia Z2 was unveiled in February 2014, the Xperia Z3 in September 2014, which means that the company will announce the Xperia Z4 rather soon, perhaps this or next month? Either way, we have some new information regarding all that to share with you, read on.

FutureSupplier, the site which leaked Xperia Z4’s alleged LCD touch digitizer back in November, has now released yet another Xperia Z4 leak. This time around the source has leaked the device’s chassis. You can check out the images down below for more information, and you’ll notice that the Xperia Z4 chassis is compared to the chassis of its predecessor, the Xperia Z3. This new chassis is about 1mm thinner than the one of its predecessor, as you can see in the images down below. If this is true, the Xperia Z4 will be really thin (thinner than the Galaxy S6 for example). There has to be a catch though, right?

There is one detail here that kind of sticks out though, the microUSB port has been moved to the bottom of the device, and it’s not protected by any sort of a flap to protect it from water. Does this mean that Xperia Z4 won’t offer waterproofing of any kind? Also, there’s no microSD card slot available, or at least it seems like it. This seems really odd, one of the main features of Sony’s Xperia Z handsets thus far was the waterproofing. Do you think it is possible that Sony is going to ditch both the waterproofing and the microSD card expansion? Let us know what you think in the comments, we’d love to hear from you.

That being said, Sony’s upcoming flagships is expected to sport a display bigger than 5-inches 1080p or QuadHD resolution (both are rumored actually), along with 3GB of RAM and a 20.7-megapixel camera. This handset will most probably be made out of metal (unibody design), and resemble its predecessors. Android Lollipop will come pre-installed on this device according to previously leaked benchmarks, and Qualcomm’s Snapdragon 810 64-bit octa-core SoC will quite probably power on Sony’s upcoming flagship.