Huawei’s latest product- IDEOS S7 Slim, is not that hard to differentiate from the original IDEOS S7 . The physical changes are obvious with some cut-off in size and swapping the resistive panel with a capacitive one. Due to the replacement of the panel, the screen does not have the soft feeling because of the resistive screen.
It is multi-touch supported in the browser and for other applications. As far as the connectivity specifications are concerned, it has integrated 3G, Bluetooth and WiFi b/g/n. It also features a HDMI output port to connect with an HDTV. The IDEOS S7 Slim can allow you to access Android Market which is a plus point when compared to other low-cost tablets.
The IDEOS S7 Slim features a WVGA display with 800 x 480 resolution whereas its competitors like the Samsung Galaxy Tab and the new HTC Flyer have 1024 x 600 resolution. The device is powered by Android OS 2.2 Froyo. There are some changes to the software as homescreens are split into entertainment, work, communications, favorites and list of all applications. All these seem good but cannot pull put like the Honeycomb(which we think is amazing).
Huawei’s IDEOS S7 Slim is expected to go on sale for less than $300 in April 2011. The company has also introduced their new smartphone X3, and a range of new modems, the HiLink and the Mobile WiFi Smart Pro hotspot. In the spring, the smartphone will be heading to Japan through the carrier Softbank while the modem HiLink will be released this April and the Mobile WiFi Smart Pro hotspot will be released in Q2 of this year.
“Huawei Reveals Expanded Suite of Smart Devices at 2011 Mobile World Congress
Huawei IDEOSâ„¢ X3 Smartphone – Sleek, stylish design, the thinnest device in the 3.2-inch screen range on the market with latest intuitive Android 2.3 interface
Huawei IDEOSâ„¢ S7 Slim next-generation tablet now more streamlined for easier portability
Huawei HiLink for automatic, hassle-free Internet connection anywhere, anytime
Huawei Mobile WiFi Smart Pro wireless modem with intelligent routing
Spain, Barcelona, 15 February 2011: Huawei, a leader in providing next-generation telecommunications network solutions for operators around the world, introduced its latest Android Gingerbread smartphone, the Huawei IDEOSâ„¢ X3, at the Mobile World Congress in Barcelona on 15th February. The ultra-stylish Huawei IDEOS X3 blends sleek hardware with high-performing software to help users more effectively manage their communication and social networking activities.
At the same event, Huawei also launched the Huawei HiLink, a plug-and-link data card which connects users to high-speed Internet on-the-go, the Huawei Mobile WiFi Smart Pro wireless modem, an intelligent device which automatically selects the best high-speed Internet connection available, as well as the Huawei IDEOSâ„¢ S7 Slim, a next-generation 7-inch capacitive touchscreen tablet offering a blend of style and portability.
“The IDEOS range and our latest mobile broadband solutions are intuitive, simple to use products that offer users an enhanced mobile experience integrated seamlessly across different wireless technologies,” said Mr. Victor Xu, chief marketing officer of Huawei Device. “As we move into 2011, Huawei will continue to lead the drive to provide consumers with smart mobile connectivity at the right price.”
The Huawei IDEOSâ„¢ X3 smartphone: intuitive, power-efficient, ultra-stylish
The Huawei IDEOS X3, featuring an ultra-slim exterior, is a high-performing smartphone that boasts a 3.2-inch capacitive HVGA touchscreen, a 3.2 megapixel camera and the Huawei Handset Over-the-Air and Online Upgrade (HOTA) solution for Android, which provides users easy and timely OS upgrades. It is the thinnest device in the 3.2 inch screen range on the market. The smartphone runs on the latest Android 2.3 Gingerbread platform, which features a refined user interface that makes the smartphone easy to navigate, more intuitive and more power-efficient.
The Huawei IDEOS X3 also comes standard with applications that allow users to easily manage information and seamlessly sync their various social communication channels.
· The Huawei IDEOSâ„¢ X3 will be available in Japan via SOFTBANK MOBILE Corp. from Spring 2011.
· The Huawei IDEOSâ„¢ S7 Slim will be available in April 2011.
· The Huawei HiLink will be available in Europe in Q2 2011.
· The Huawei Mobile WiFi Smartpro will be available in Q2 2011.”